Mold Engineering

"Mold Engineering" deals with injection molds for thermoplastic molding materials and their performance. However, many of the subjects treated here also apply to other molds such as blow molds and molds for thermosets. It presents in an easy to understand language, with a minimum of mathematics or difficult theories, a practical approach for the design of injection molds. The subjects are brok…

Cost Accounting

Edisi

1

ISBN/ISSN

.

Deskripsi Fisik

80 hal.; 28 cm

Judul Seri

-

No. Panggil

657.42 AFS

Fundamentals of Electronic Circuit Design

This brief alternative to traditionally sequenced texts presents the fundamental principles of modern electronic circuit design. It features all the breadth of coverage you would find in a larger text, but at a depth that makes it easy to cover in one semester. The authors focus on modern, integrated circuit design and concentrate on two devices that are used in practice today: the metal-oxide …

Printed Circuits Handbook

PART 1 INTRODUCTION TO PRINTED CIRCUITS Chapter 1 Electronic Packaging and High-Density Interconnectivity Chapter 2 Semiconductor Packaging Technology Chapter 3 Advanced Packaging Chapter 4 Types of Printed Wiring Boards PART 2 MATERIALS Chapter 5 Introduction to Base Materials Chapter 6 Base Material Components Chapter 7 Base material manufacturing Processes Chapter 8 Properties of …

Digital Signal Processing: A Hands-on Approach

Chapter 1 Introduction to Digital Signal Processing 1 Chapter 2 Converting Analog Signals to Digital Signals 21 Chapter 3 Correlation and Convolution 47 Chapter 4 Periodic Functions and Fourier Synthesis 77 Chapter 5 Discrete Fourier Transform 99 Chapter 6 Windows 125 Chapter 7 Digital Filters 145 Chapter 8 Practical Implementation of Filters 183 Chapter 9 Digital Signa…

Fundamentals of Semiconductor Fabrication

Chapter 1 Introduction 1 Chapter 2 Crystal Growth 17 Chapter 3 Silicon Oxidation 41 Chapter 4 Photolithography 60 Chapter 5 Etching 85 Chapter 6 Diffusion 105 Chapter 7 Ion Implantation 124 Chapter 8 Film Deposition 144 Chapter 9 Process Integration 182 Chapter 10 IC Manufacturing 226 Chapter 11 Future Trends and Challenges 259 This concise introducti…

Power Boiler Design, Inspection, And Repair

Features: . Installation, Operation, Inspection, and Maintenance methods. . A boiler inspector's insights on meeting code requirements. . Expert advice on repair and alteration to National Board of Boiler and Pressure Vessel Inspectors standards. . Design specifications. . Code calculations. . Tips on complying with local and national requirements. Chapter 1 Boiler Fundamentals C…

Mechanics of Materials

1 Introduction-Concept of Stress 2-46 2 Stress and Strain-Axial Loading 47-131 3 Torsion 132-208 4 Pure Bending 209-307 5 Analysis and Design of Beams for Bending 308-371 6 Shearing Stresses in Beams and Thin-Walled Members 372-422 7 Transformations of Stress and Strain 423-495 8 Principal Stresses Under A Given Loading 496-529 9 Deflection of Beams 530-606 1…

Fundamentals of Semiconductor Devices

PART 1 MATERIALS 1 Chapter 1 Electron Energy and States in Semiconductors 3 Chapter 2 Homogeneous Semiconductors 48 Chapter 3 Current Flow in Homogeneous Semiconductors 111 Chapter 4 Nonhomogeneous Semiconductors 159 Supplement to part 1 179-234 PART 2 DIODES 235 Chapter 5 Prototype pn Homojunctions 239 Chapter 6 Additional Considerations for Diodes 311 Supplement to …

Pengantar Sistem Kendali Otomatik

Edisi

1

ISBN/ISSN

.

Deskripsi Fisik

185 hal, gmbr, 25 cm

Judul Seri

-

No. Panggil

629.8 MAS