Assembling And Dismantling

Edisi

1

ISBN/ISSN

.

Deskripsi Fisik

115 hal.; gmbr.; 29,5 cm

Judul Seri

-

No. Panggil

670.42 LEA

Machine Elements

Edisi

1

ISBN/ISSN

.

Deskripsi Fisik

xi. 356 hal.; gmbr.; 26 cm

Judul Seri

-

No. Panggil

621.8 NIE

Machine Elements

Edisi

1

ISBN/ISSN

.

Deskripsi Fisik

91 hal.; gmbr.; 29 cm

Judul Seri

-

No. Panggil

621.8 GUN

Pengantar Perancangan Teknik (Perancangan Produk)

Buku ini setelah menyelesaikan matakuliah 'Perancangan Elemen Mesin'. Perancangan Teknik = Perancangan Produk, yaitu benda teknik yang terdiri dari banyak elemen dengan berbagai macam bentuk & fungsinya. Produk yang dirancang dapat berupa produk baru atau produk original, produk modifikasi atau produk inovasi. Proses perancangan teknik terdiri dari urutan kegiatan yang disebut dengan f…

Mold Engineering

"Mold Engineering" deals with injection molds for thermoplastic molding materials and their performance. However, many of the subjects treated here also apply to other molds such as blow molds and molds for thermosets. It presents in an easy to understand language, with a minimum of mathematics or difficult theories, a practical approach for the design of injection molds. The subjects are brok…

Cost Accounting

Edisi

1

ISBN/ISSN

.

Deskripsi Fisik

80 hal.; 28 cm

Judul Seri

-

No. Panggil

657.42 AFS

Fundamentals of Electronic Circuit Design

This brief alternative to traditionally sequenced texts presents the fundamental principles of modern electronic circuit design. It features all the breadth of coverage you would find in a larger text, but at a depth that makes it easy to cover in one semester. The authors focus on modern, integrated circuit design and concentrate on two devices that are used in practice today: the metal-oxide …

Printed Circuits Handbook

PART 1 INTRODUCTION TO PRINTED CIRCUITS Chapter 1 Electronic Packaging and High-Density Interconnectivity Chapter 2 Semiconductor Packaging Technology Chapter 3 Advanced Packaging Chapter 4 Types of Printed Wiring Boards PART 2 MATERIALS Chapter 5 Introduction to Base Materials Chapter 6 Base Material Components Chapter 7 Base material manufacturing Processes Chapter 8 Properties of …

Digital Signal Processing: A Hands-on Approach

Chapter 1 Introduction to Digital Signal Processing 1 Chapter 2 Converting Analog Signals to Digital Signals 21 Chapter 3 Correlation and Convolution 47 Chapter 4 Periodic Functions and Fourier Synthesis 77 Chapter 5 Discrete Fourier Transform 99 Chapter 6 Windows 125 Chapter 7 Digital Filters 145 Chapter 8 Practical Implementation of Filters 183 Chapter 9 Digital Signa…

Fundamentals of Semiconductor Fabrication

Chapter 1 Introduction 1 Chapter 2 Crystal Growth 17 Chapter 3 Silicon Oxidation 41 Chapter 4 Photolithography 60 Chapter 5 Etching 85 Chapter 6 Diffusion 105 Chapter 7 Ion Implantation 124 Chapter 8 Film Deposition 144 Chapter 9 Process Integration 182 Chapter 10 IC Manufacturing 226 Chapter 11 Future Trends and Challenges 259 This concise introducti…