Printed

Handbook Of Lapping And Polishing

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Lapping and polishing are currently the most precise surface finishing processes for mechanical and electronic components. Unfortunately, most improvements in either methods or understanding of the physical processes involved are closely guarded as proprietary information. 'The Handbook of Lapping and Polishing' is the 1st source in english to bring to the light of day the physical fundamentals and advanced technologies at the leading edge of modern lapping and polishing practice.

Guiding the selection of the best process and hardware, this book
- Provides authoritative and reliable information on the latest
developments in lapping and polishing theory and technology,
- Examines lapping process mechanisms, subsurface damage,
material removal, tool specification, modeling, and simulation,
- Presents an extensive case study on lapping of brittle
materials and another on CMP (Chemical-Mechanical Polishing)
for semiconductors,
- Outlines the major hardware used for lapping and polishing
processes, emphasizing accuracy and intended application.

Offering an integrated approach to both theory and practical applications under a single cover, the 'handbook of lapping and polishing' supplies a definitive survey of the most advanced surface finishing technologies available.

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Ketersediaan

Informasi Detail

Judul Seri

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No. Panggil

R 671.35 MAR h

Penerbit

Boca Raton : CRC Press., 2007

Deskripsi Fisik

xvi, 491 hal. : ilus. ; 23,5 cm

Bahasa

English

ISBN/ISSN

1-57444-670-3

Klasifikasi

671.35

Tipe Isi

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Tipe Media

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Tipe Pembawa

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Edisi

1

Subjek

Manufaktur

Info Detail Spesifik

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Pernyataan Tanggungjawab

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Versi lain/terkait

Lampiran Berkas

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