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Power Integrity Modeling and Design for Semiconductors and Systems

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Professionals such as signal integrity engineers, package designers, and system architects need to thoroughly understand signal and power integrity issues in order to successfully design packages and boards for high speed systems. Now, for the first time, there's a complete guide to power integrity modeling: everything you need to know, from the basics through the state of the art.
Using realistic case studies and downloadable software examples, two leading experts demonstrate today's best techniques for designing and modeling interconnects to efficiently distribute power and minimize noise.
This book's system level focus and practical examples will make it indispensable for every student and professional concerned with power integrity, including electrical engineers, system designers, signal integrity engineers, and materials scientists. It will also be valuable to developers building software that helps to analyze high speed systems.

Chapter 1 BASIC CONCEPTS (1-82):
1.1 Introduction , 1
1.2 Simple Relationships for Power Delivery , 10
1.3 Design of PDNs , 17
1.4 Components of a PDN , 24
1.5 Analysis of PDNs , 45
1.6 Chip Package Antiresonance: An Example , 61
1.7 High Frequency Measurements , 65
1.8 Signal Lines Referenced to Planes , 71
1.9 PDN Modeling Methodology , 77
1.10 Summary , 79.
Chapter 2 MODELING of PLANES (83-174):
2.1 Introduction , 83
2.2 Behavior of Planes , 84
2.3 Lumped Modeling Using Partial Inductances , 89
2.4 Distributed Circuit Based Approaches , 94
2.5 Discretization Based Plane Models , 117
2.6 Analytical Methods , 133
2.7 Multiple Plane Pairs , 138
2.8 Summary , 169.
Chapter 3 SIMULTANEOUS SWITCHING NOISE (175-242):
3.1 Introduction , 175
3.2 Simple Models , 177
3.3 Modeling of Transmission Lines and Planes , 185
3.4 Application of Models in Time Domain Analysis209
3.5 Application of Models in Frequency Domain
Analysis , 226
3.6 Extension of M-FDM to Incorporate Transmission
Lines , 233
3.7 Summary , 239.
Chapter 4 TIME DOMAIN SIMULATION METHODS (243-332):
4.1 Introduction , 243
4.2 Rational Function Method , 244
4.3 Signal Flow Graphs , 295
4.4 Modified Nodal Analysis (MNA) , 317
4.5 Summary , 327.
Chapter 5 APPLICATIONS (333-450):
5.1 Introduction , 333
5.2 High Speed Servers , 334
5.3 High Speed Differential Signaling , 349
5.4 Analysis of IC Packages , 365
5.5 Extraction of Dielectric Constant and Loss
Tangent , 372
5.6 Embedded Decoupling Capacitors , 392
5.7 Electromagnetic Bandgap (EBG) Structures , 415
5.8 Future Challenges , 443.
APPENDIX A (451-458):
A 1 Multiport Networks , 451
A 2 Matrix Representation of Transmission Lines, 453
A 3 Spectrum of Digital Signals , 454
APPENDIX B SOFTWARE LIST , 459-460.

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Ketersediaan

Informasi Detail

Judul Seri

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No. Panggil

621.381 SWA p

Penerbit

New Jersey : Prentice Hall., 2008

Deskripsi Fisik

xxi, 471 hal. : ilus. ; 24 cm

Bahasa

English

ISBN/ISSN

978-0136152064

Klasifikasi

621.381

Tipe Isi

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Tipe Media

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Tipe Pembawa

-

Edisi

1

Subjek

Teknik Elektronika

Info Detail Spesifik

-

Pernyataan Tanggungjawab

-

Versi lain/terkait

Lampiran Berkas

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