Printed

Printed Circuit Boards Design and Technology

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PART A: DESIGN of PRINTED CIRCUIT BOARDS (2-165):
1 Layout Planning 4
2 Layout, General Rules, and Parameters 17
3 Design Rules for Digital Circuit PCBs 33
4 Design Rules for PCBs in High Frequency and Fast
Pulse Applications 59
5 Design Rules for Analog Circuit PCBs 95
6 Design Rules for PCBs in Power Electronics
Applications 105
7 Design Rules fo PCBs in Microwave Applications114
8 Artwork 129
9 Automation and Computers in PCB Design 151

PART B: TECHNOLOGY of PRINTED CIRCUIT BOARDS
(168-438):
10 Film Master Production 170
11 Properties of Copper Clad Laminates 199
12 Board Cleaning before Pattern Transfer 225
13 Photoprinting 232
14 Screen Printing 255
15 Plating 270
16 Etching 292
17 Mechanical Machining Ooperations 314
18 PCB Technology Trends 333
19 Multilayer Boards 367
20 Solders and Soldering Techniques 382
21 Component Assembly Techniques 409
22 Guidelines for Starting PCB Facilities 419

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Ketersediaan

Informasi Detail

Judul Seri

CEDT (Centre for Electronics Design and Technology)

No. Panggil

621.381 BOS

Penerbit

New Delhi : McGraw-Hill., 1985

Deskripsi Fisik

xii, 467 hal, gmbr, 26 cm

Bahasa

English

ISBN/ISSN

.

Klasifikasi

621.38

Tipe Isi

-

Tipe Media

-

Tipe Pembawa

-

Edisi

1

Subjek

Circuit

Info Detail Spesifik

-

Pernyataan Tanggungjawab

-

Versi lain/terkait

Lampiran Berkas

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